Die and method of making the same

ABSTRACT

A high precision die particularly adapted to form, from a relatively heavy foil sheet, a circuit board where the individual circuit elements and the spacing thereof are of relatively small dimensions. The die is made as follows. A working surface of a die block is covered with a first protective overlay having an enlarged pattern corresponding to the pattern of the die elements to be formed, but enlarged by a substantially uniform width dimension. The surface is then exposed to an etching solution to remove material from the exposed area. These two steps are repeated a second time with a pattern enlarged to a lesser degree, and again a third time to bring the die elements being formed from the die block within quite close tolerances to the original pattern. The die faces of the die elements are then etched to form knife edges on the die elements, in a plurality of etching steps using reduced protective overlay patterns.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a continuation-in-part application of my co-pending U.S. patent application, Ser. No. 696,564, filed June 16, 1976, now U.S. Pat. No. 4,053,348.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a die and a method of making the die. The die is adapted to stamp out from metal foil, circuit elements of a circuit board pattern and simultaneously bond the circuit elements to a substrate. More particularly this is a high precision die capable of forming circuit boards from relatively thick foil sheets, with the width dimensions of the circuit elements and the spacings thereof being of relatively small dimensions.

2. Description of the Prior Art

In my earlier patent, U.S. Pat. No. 3,758,350, entitled "Method of Making a Die for Stamping Out Circuit Boards", there is disclosed a method of etching a die block to form an improved die particularly adapted for forming a relatively compact circuit board where the circuit elements are of relatively small width and with small separation therebetween. In that method, first there is formed a conventional flat face die, comprising flat face die elements with intervening recess areas, this being accomplished in a conventional manner. Then the recess areas are filled with an acid resisting epoxy, and a photo resist is applied over the epoxy in a manner to overlap the outer edge portions of the die elements so that the middle portion of each die element is exposed. The die is then exposed to an etching medium to form a die element recess in the middle portion of each die element, with shoulders being formed along the edge portions of each die element. Next the acid resist material is removed, and with the recess filling epoxy still remaining the die surface is again etched for a short period of time. In one form, the final etching is done in a manner to provide "modified" die element edge portions where the inner edge surface of each die element edge portion is somewhat rounded, and in another embodiment, the final etching is accomplished in a manner to provide a knife edge die.

While the method described above has proven quite effective in making precision dies effective for high production manufacture of circuit boards, there is still a need for further improvement in the die making process. For many industrial applications it is desirable to have the elements of the circuit board made from a thicker foil sheet to enhance the reliability of the circuit elements being formed and their capability of handling higher current loads. Yet there is the continuing demand for yet greater compactness, which means making both the individual circuit elements and the separating areas between the elements of smaller width dimensions.

In a circuit board manufacturing operation, it is desirable to accomplish both the forming of the circuit elements from the foil sheet and the bonding of these circuit elements to a dielectric substrate in one stamping operation. This is usually accomplished by providing a thermo-adhesive coating between the foil sheet and the substrate and heating the die prior to the stamping operation. When the heated die is brought into engagement with the foil sheet, the die elements press into the foil sheet to separate the circuit elements from the foil sheet and press these into firm engagement with the substrate while heating the underlying adhesive layer to cause bonding of the circuit elements to the substrate. The excess foil adjacent the die elements does not become bonded to the substrate, and this excess foil is simply stripped away from the dielectric material after the die is moved away from the circuit board just formed.

However, when it is attempted to use heavier foils to make circuit boards where the width and spacing of the elements are still quite small, the problems of properly accomplishing this simultaneous forming and bonding of the circuit elements are greatly aggravated. First, with regard to the individual die element, the edge portions of each die element must be of a height sufficient to cause a separation through the entire thickness of the foil sheet. Secondly, the depth of the recess area of the die must be sufficient to permit the excess foil to become positioned in such recess area during the stamping operation, without the excess foil becoming bonded to the substrate. With regard to this problem of the unintended bonding of the excess foil, it is necessary to make a distinction between "background" areas of the die and "separating" areas of the die and of the circuit board being formed. The "separating" areas are those existing between two adjacent circuit elements, and with the type of circuit boards being considered herein, these separating areas are in the order of 15 to 50 thousandths of an inch in width. The "background" areas are those of substantially greater dimensions that separate groups of circuit elements being formed. Both the separating areas of the die and the background areas must be recessed to a depth sufficient to accommodate the excess foil. But in the background areas there is need for yet greater depth because of a tendency of the larger pieces of excess foil to buckle or bend during the stamping process and thus cause unintended bonding of this excess foil to the substrate during the stamping operation.

When it is attempted to employ etching techniques to achieve greater depth in the recess areas being formed, the problems in maintaining a high degree of precision, particularly with respect to adhering to a preselected pattern within relatively close tolerances, are substantially aggravated. When a resist pattern is applied to the surface of a die block and the etching solution is applied to the surface, the etching solution tends to work not only downwardly in the exposed area, but also laterally to "undercut" the material beneath the resist pattern. However, the degree of such undercutting is by no means always uniform. First, impurities or lack of uniformity in the material being etched (e.g., carbon particles in steel) can impede the progress of the etching medium in certain areas. Second, the resist material that overhangs the undercut may break away in certain areas, with the result that the undercut areas with the more exposure etch away at a faster rate than those areas where the existing overhang impedes access of the etching medium to the material just below the resist pattern. Thus, there is a tendency for the final configuration of the die elements to have "strayed" from the pattern of the original art work according to which the die is to be formed. These same problems exist in attempting to obtain greater depth in the recess areas in the faces of the die elements themselves, in that the undercutting of the etching medium causes greater inaccuracy in the final configuration of the upstanding edge portions of the die elements.

It can be appreciated that this problem becomes especially critical when it is attempted to form the edge portions of the individual die elements within quite close tolerances (e.g., a thousandth of an inch or less) so that these can properly perform their function of separating the quite small circuit elements from the foil, which may be as small as 10 thousandths of an inch wide. Not only is this precision of importance in the initial formation of the die, but also with regard to future maintenance of the die. As the edge portions of the individual die elements become worn, resharpening becomes necessary, and with the very small dimensions involved, this resharpening can best be accomplished by means of etching. Such resharpening can only be accomplished properly if the initial formation of the circuit elements is within proper tolerances.

In view of the foregoing, it is an object of the present invention to provide an improved die and a method of making a die within very close tolerances, which die is particularly adapted for forming a circuit board from relatively thick foil, with the width dimensions and spacing of the circuit elements being of a relatively small dimension.

SUMMARY OF THE INVENTION

The preferred form of the present invention provides a precision die and a method of making the same, said die being particularly adpated to form from a heavy foil sheet a circuit board comprising a plurality of circuit elements corresponding within close tolerances to a preselected base pattern of pattern figures, each with delineating edges lines. The present invention can also be advantageously used in forming circuit boards from thinner (e.g., one half to one ounce copper) foil where the spacings between circuit elements and the widths of the elements themselves are as close as 0.008 to 0.020 inch. The pattern has separating areas which separate relatively closely spaced circuit elements and at least one background area of relatively larger width dimension that separates more widely spaced circuit elements or groups of circuit elements. The die has die elements adapted to engage the foil to form the circuit elements therefrom, with each of the die elements having a surface area with edge portions corresponding closely to edge lines of a related pattern figure, and side walls leading from its edge portions into adjacent recesses on opposite sides of the die element.

In the method of the present invention, there is first provided a die block having a working face at which the die elements are to be formed. To perform certain etching operations on this die block, there are made a plurality of modified overlay patterns, each of which has a pattern base area corresponding in configuration to the original base pattern, and an enlarged edge portion extending beyond the delineating edge lines of the base pattern by a predetermined substantially uniform width dimension. In the preferred form, these overlay patterns comprise:

a. a first background pattern, having an enlarged edge portion of a greater width which is less than half the width dimension of the related background area,

b. a second separating overlay pattern having an enlarged edge portion of an intermediate width which is less than half the spacing of closely spaced circuit elements, and

c. a third truing overlay pattern having an enlarged edge portion of a relatively small width dimension corresponding quite closely to the base pattern.

The die block is then subjected to three etching operations, using in sequence protective overlays corresponding to the three patterns noted above. A first protective overlay corresponding to the first background pattern is applied to the face of the die block, and the die block is then exposed to an etching medium to form a recessed area at least at the background area and provide a first relief area including the portion of the die block in which the die elements are to be formed.

The working face of the die block is then covered with a second protective overlay corresponding to the second overlay pattern to expose a greater portion of the background area and also expose at least a portion of the separating areas in the die block. The face of the die block is again exposed to an etching medium to remove further material from the background area and also to form recesses at the separating areas at the die block.

For the third etching operation, the working face of the die is covered with a third overlay corresponding to the third truing pattern. This protects the areas of the die at which the circuit elements are to be finally formed and also extends moderately beyond the edge portions thereof. The working face of the die is then exposed to an etching medium for a third time to form the die elements to a configuration corresponding quite closely to the preselected base pattern. In some instances it is possible to leave out the background etch and proceed initially from the intermediate etch to the truing etch.

Next the surface area of the individual die elements are formed each with a middle recess to leave upstanding foil engaging edge portions of the die elements. One method of accomplishing this is that disclosed in my earlier patent, U.S. Pat. No. 3,758,350. To describe this briefly, the recesses between the die elements are filled with a protective material, such as epoxy resin, and then the working faces of the die elements are exposed to an etching medium to form the middle recess and provide upstanding edge portions adjacent to the protective material placed in the recesses. This is desirably accomplished in a two-stage etching process, where a protective overlay is applied over the edge surface portions of the individual die elements, after which a first etch is accomplished. Then the protective coating is removed, and the exposed surfaces of the die elements are exposed to an etching medium a second time to remove further material from the upstanding edge portions to form the foil engaging edges of the die element. Alternately, this second material removal step can be accomplished by applying a fine abrasive material against the die surface, as by sandblasting, or in some instances by a hand operation by use of a deburring tool.

A second method of forming middle recesses in the die elements is employed where it is desired to obtain greater depth in these recesses. This is multi-stage, step-back process where a plurality of reduced patterns are employed. In the preferred embodiment disclosed herein, there is provided a first "slightly reduced" pattern where the modified pattern elements have the perimeter portions thereof reduced by a uniform dimension only slightly less than the original pattern elements; a "moderately reduced" pattern where there is a further reduction in the perimeter portions of the pattern elements; and a third "substantially reduced" pattern where the perimeter portions of the pattern elements are reduced to a greater extent.

After the recesses between the die elements are filled with an epoxy resin, first a resist pattern corresponding to the "substantially reduced" pattern is applied to the face of the die, after which the die surface is exposed to an etching solution to form recesses in the exposed surfaces of the die elements. Next, the "moderatedly reduced" pattern is used to form a resist pattern on the die face, and it is again exposed to an etching solution to further deepen recesses of the die elements and bring the resulting upstanding edge portions of the die elements closer to the configuration of the original pattern. Finally, a third resist pattern corresponding to the "slightly reduced" pattern is applied and a further etching is accomplished to deepen the die element recesses further.

Then, as in the first method, the acid resist pattern is removed and the die block is then exposed to an etching solution for a period of time to form the upstanding shoulder portions of each die element into knife edges. Alternately, as indicated above, this can be accomplished by sandblasting with a fine abrasive material, or in some instances, by a deburring tool.

The die of the present invention is particularly adapted to form from a relatively heavy foil sheet a plurality of individual circuit elements and simultaneously bond these elements to a dielectric substrate. The circuit elements correspond within quite close tolerances to a preselected base pattern. This die comprises a plurality of die elements each of which has a foil engaging surface area with upstanding foil engaging edge portions corresponding to edge lines of the circuit elements being formed.

Some of the die elements are spaced quite closely together and have "separating recesses" corresponding in location to the separating areas of the base pattern. The die also has at least one background recess corresponding in location to the background area of the base pattern. The depth of the background recess is greater than that of the separating recesses. Thus, when the die is pressed against the foil sheet to form the circuit board, excess foil at the separating recess areas is able to become located in the background recess without becoming bonded to the substrate.

Each of the die elements has side walls defining the adjacent recesses, and in the preferred form these side walls are of substantially uniform slope. Thus, when the upstanding edge portions of the die elements are sharpened by means of an etching operation, the etching is more uniform so that the sharpened edge portions of the die element are of a substantially uniform height.

Within the broader scope of the present invention, there is provided a method of making a precision die having die elements corresponding within close tolerances to a preselected base pattern. Broadly, this method comprises providing a plurality of modified overlay patterns, each of which has a pattern area made up of a base area corresponding in configuration to the base pattern and having an enlarged edge portion extending beyond the delineating edge lines of the base pattern by a predetermined uniform width dimension. There are at least two such overlay patterns comprising at least a first overlay pattern having an enlarged edge portion of a greater width, and a second overlay pattern having an enlarged edge portion of a lesser width corresponding more closely to the base pattern.

The working face of the die block is covered with a first protective overlay corresponding to the first overlay pattern to protect the working face portion of the die block beneath the pattern area of the first overlay pattern and leaving the remaining area exposed. The working face of the die is then exposed to an etching medium to form a recessed area at the exposed portion of the working face of the die and to provide a first relief area corresponding generally to the first overlay pattern. Then the working face of the die is covered with the second protective overlay corresponding to the second overlay pattern to protect that portion of the first relief area beneath the pattern area of the second protective overlay and leave a second remaining area exposed. The working face of the die is again exposed to an etching medium to remove material from the die block and cause the relief area to be further formed in a configuration of die elements corresponding more closely to the pattern figures of the base pattern according to which the die was formed.

Other features of the invention will become apparent from the following detailed description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of original art work used as the base pattern in the method of the present invention;

FIG. 2 is an isometric view of the art work being applied to a glass plate having a photographic emulsion thereon;

FIG. 3 is a side view showing the lay up of FIG. 2 being exposed to a light source to make a reproduction thereof;

FIG. 4 is a plan view of a portion of the negative resulting from the step of FIG. 3, drawn to an enlarged scale;

FIG. 5 is an isometric view of an apparatus by which modified overlay patterns are made from the negative pattern shown in FIG. 4;

FIGS. 6, 7 and 8 are plan views, drawn to an enlarged scale, of three "enlarged" patterns prepared by the apparatus of FIG. 5;

FIGS. 9 through 23 are sectional views of a portion of a die block which is subjected to the process of the present invention to make a finished die;

FIG. 24 is a sectional view of one die element, drawn to a further enlarged scale, of a die made according to the method of the present invention;

FIG. 25 is a plan view of a portion of a positive made according to the steps described with reference to FIG. 17 and used in a second embodiment of the present invention;

FIGS. 26, 27 and 28 are plan views drawn to an enlarged scale of portions of three modified "reduced" patterns prepared by the apparatus of FIG. 5 in the second embodiment of the present invention;

FIGS. 29 through 35 are sectional views of a portion of a die element of a die block which is subjected to the process of the second embodiment of the present invention to make a finished die; and

FIG. 36 is a sectional view of one die element of a die made according to the method of the second embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENT

In FIG. 1 there is shown in plan view typical art work for a printed circuit board to be manufactured by a die made according to the process of the present invention. This art work 10 comprises a transparent sheet 12 on which is drawn a pattern of solid opaque figures 14 which are an accurate representation of the circuit elements of the circuit board to be manufactured as the end product. The figures 14 should be drawn within the engineering tolerances (e.g. plus or minus three thousandths of an inch) desired for the end product.

(a) Preparation of Overlay Patterns

Prior to the actual physical operations of forming the die from a die block, there are the preliminary steps of providing a set of overlay patterns for subsequent etching operations. These will now be described with reference to FIGS. 2 through 8.

The first step is to prepare a negative from the art work 10 shown in FIG. 1. The art work 10 is placed onto a glass plate 16 having a photographic emulsion on one surface thereof. For accurate reproduction, the side of the art work 10 on which the figures 14 are drawn should be placed directly against the glass plate surface having the emulson thereon. Next, as shown in FIG. 3, light is directed from a source 18 through the art work 10 against the emulsion on the glass plate 16. The emulsion on the glass plate is then developed according to conventional photographic techniques to provide a negative image of the art work 10. A portion of such a negative image is shown at 20 in FIG. 4 where the circuit element image 22 appears as a transparency with an opaque surrounding area 24.

The glass plate negative reproduction 16 is then used to make a series of three overlay patterns, shown at 25a, 25b, and 25c in, respectively, FIGS. 6, 7 and 8, which patterns are modified reproductions of the art work 10. The apparatus used to accomplish this is shown in FIG. 5 and is described in my earlier patent, U.S. Pat. No. 3,758,350, mentioned above. A photographic film is placed on a base plate 26 and the blass plate 16 is mounted to an upper frame 28, with the emulsion face of the glass plate 16 facing downwardly so as to be against the photographic film on the base plate 26. The frame 28 is mounted to a set of four rotatable eccentrics 30 which when rotated in unison give the frame 28 a circular wobbling motion while maintaining the same orientation of the frame 28 and the glass plate 16 attached thereto. A light source is directed downwardly on the frame 28 and plate 16.

Since the image on the glass place 16 is a negative of the art work 10 so that the figures 14 appear as transparenices, the wobbling motion imparted to the plate 16 expands or widens the image of each of the figures 14 by an edge width increment equal to the radius of wobble of the eccentrics 30 to produce an "enlarged" or "widened" pattern. As can be seen by an examination of FIGS. 6, 7 and 8, where portions of three such patterns are shown to an enlarged scale, eccentrics of three different radii are used. To produce the pattern 25a of FIG. 6, eccentrics 30 of relatively large radii are used (in the order of 30 thousandths of an inch); to produce the pattern 25b of FIG. 7, eccentrics of substantially lesser radii are used (in the order of 10 thousandths of an inch); and finally, to produce the pattern 25c of FIG. 8, eccentrics 30 of quite small radii are used (in the order of three to four thousandths of an inch).

For purposes of analysis, in each of the patterns 25a, b and c, the pattern of the original art work which can be considered the "base pattern", is indicated in broken lines at 14a. Each figure 14 (indicated in FIGS. 6, 7 and 8 as 14a) has a strip portion 32 and a terminal pad portion 34. For the sake of example, let it be assumed that the total width dimension of the strip portion 32 is approximately 15 thousandths inch and that the minimum spacing between the strip portion 32 of two figures 14 is 30 thousandths of an inch. In the final circuit board to be manufactured, the insulating area between two adjacent conducting strips (i.e. the "separating" area) corresponds to the area indicated at 36 between the two figures 14a of FIGS. 6, 7 and 8. In addition, there is indicated in FIG. 6 the "background" area 38 which is an area of substantially greater width dimension existing between two spaced groups of figures 14.

To examine specifically the overlay pattern of FIG. 6, there is an opaque area 40 and a transparent area 42. The opaque area 40 includes the base pattern area 14a corresponding to each of the figures 14 of the original art work 10 shown in FIG. 1. In addition there is for each area 14a an enlarged edge portion 44 which extends beyond the delineating edge line of the base figure area 14a by a substantially uniform width dimension. In particular example of FIG. 6, this width dimension is 30 thousandths of an inch. With the spacing of the two figure areas 14a being less than 60 thousandths of an inch, the "separating" area between the figures 14a is completely covered by the opaque area 40 of the pattern 25a.

In the pattern 25b shown in FIG. 7, there is within the opaque area 40' the base pattern 14a' having an enlarged edge portion 44' of substantially smaller width than that of the pattern 25a of FIG. 6. This results in a portion of the separating area 36' between the two figure areas 14a' being part of the transparent area 42'.

Finally, in the pattern of FIG. 8, it can be seen that the enlarged edge portion 44" is of a relatively small width so that the over all pattern in FIG. 8 is nearly the same as that shown in FIG. 1, with the base figures 14a being enlarged just slightly in all width dimensions (e.g. several thousandths of an inch).

(b) Etching the Recesses in the Die Block by Use of the Modified Patterns

The three overlay patterns 25a, b and c shown in FIGS. 6, 7 and 8 are used in a three step etching process as follows:

1. The background etch.

The pattern of FIG. 6 is used to etch away material to form a recessed area in the background portion of the die to be formed.

2. The separating etch.

The pattern of FIG. 7 is used to etch away material in the separating areas of the die to be formed so as to delineate roughly the individual die elements, and cause further removal of the material in the background area.

3. The truing etch.

The pattern of FIG. 8 is used to etch away material on the side walls of the die elements being formed to bring these into configuration corresponding quite closely to the original art work as shown in FIG. 1.

these three steps will now be described with reference to FIGS. 9 through 15. First, a die blank (i.e. a rectangular block of material 46 made of a suitable metal, such as low carbon steel or an air-hardening or oil-hardening steel) is machined to provide a flat face which is to be the die face. This face is cleaned with pumice and water and then etched for a short period of time with a suitable solution (e.g. ferric chloride) to give a roughness to hold a photo resist material and then cleaned once again with pumice and water and air dried. Then a photo resist material 48 (e.g. KMER, which is Kodak Metal X Resist) is diluted and applied to the die surface in a layer between about 0.0005 and 0.001 inch thick. It is air dried for about ten minutes and then baked in an oven at 250° F. for about a half hour and air cooled. This is done in a room using yellow safety lighting.

Next a negative 50 of the first enlarged pattern 25a shown in FIG. 6 is placed on top of the photo resist 48. The transparent portions of the negative correspond to the enlarged figure area 40, and the opaque portions of the negative correspond to the background area 38. A light source is directed onto the negative to harden the exposed portions of the resist 48. The die block 46 is then placed in a resist developing solution for about a minute to wash away the undeveloped areas of the resist, and then is rinsed in water to remove the developer. The result is an acid resist overlay which covers an area corresponding to the base pattern area 14a and the enlarged edge portion area 44 of the pattern 25a of FIG. 6, and leaves exposed the background area 38. A portion of this overlay is indicated at 52 in FIG. 10.

The die block 46 with the pattern overlay 52 thereon is placed in an etching machine which splashes acid onto the die face. In the particular example disclosed herein, where the width enlargement of the base pattern is thirty thousandth inch, the etching would be continued for approximately 16 minutes to etch to a depth of approximately 20 thoudandths inch and undercut laterally beneath the acid resist overlay approximately 10 thoudandth inch. For best results, this 16 minute etch period should be accomplished in short segments of 40 seconds, with the die block 46 being removed from the etcher and the etched areas being brushed with a soft brush to remove any impurities or particles of carbon which might impede the etching rate in small areas. The resulting configuration of the die block 46 after this first "background" etch is illustrated in FIG. 11. There is a recessed area 54 corresponding generally to the background area 38 of the pattern 25a of FIG. 6. The area under the overlay pattern 52 is a relief area 56 corresponding generally to the enlarged pattern area 40 of the overlay pattern 25a of FIG. 6.

Next the die block is subjected to a second etching step, which is the "separating" etch. This is accomplished in substantially the same manner as the initial background etch, described above with reference to FIGS. 9 through 11. As shown in FIG. 12, there is applied to the etched surface of the die block 46 an acid resist overlay corresponding to the second overlay pattern 25b, shown in FIG. 7. This is accomplished by first applying a uniform resist coating, placing a negative immage of the second overlay pattern 25b over the resist coating, directing a light source on the exposed resist areas to cause these to harden, and washing away the undeveloped areas. On that portion of the die block 46 shown in FIG. 12, the resulting overlay pattern is shown as two overlay resist sections 58 corresponding to the pattern areas 44' shown in FIG. 7.

The working face of the die block 46 is again exposed to an etching solution, in much the same manner as the etching step described immediately above, for a period of about 10 minutes. The result is that the background recess area 54 is made about 13 thousandths of an inch deeper, as indicated at 54' in FIG. 13 and the separating recesses are also formed in the die block 46 to a depth of about 13 thousandths of an inch. (As indicated previously herein, the separating area is that which divides adjacent circuit elements, and the separating recess is an area of the die block 46 corresponding to such separating area in the circuit board to be formed. The separating recess shown in FIG. 13 in this intermediate stage is designated 60, and it can be seen that this recess 60 separates the previously formed relief area 56 of FIG. 11 into two relief elements 62 corresponding generally to the configuration of the die elements ultimately to be formed.)

The third etching step (i.e. the "truing" etch) is now performed in much the same manner as the previous two etching steps. To accomplish this truing etch, the acid resisting overlay 65 is applied in accordance with the overlay pattern 25c shown in FIG. 8. The die block 46 is then etched for a somewhat shorter period of time (e.g. 6 minutes) which is closely controlled to bring the side walls 64 of the two elements 62 to a configuration corresponding quite closely to the original art work shown in FIG. 1. The side walls so formed after this truing etch are shown in FIG. 15 and designated 64. In this truing etch there is, of course, further deepening of the previously formed recesses 60 and 54.

(c) First Method of Forming the Individual Die Elements with Raised Edge Portions and a Recessed Middle Portion

The configuration of the die block 46 resulting from the etching steps described above has a portion thereof shown in FIG. 16. In FIG. 16, there are shown two die elements 66 spaced one from another by a separating recess 68, with two background recesses 70 on opposite sides of the two elements 66. Each die element 66 has a flat die surface 72 which lies in substantially the same plane as the original working face of the die block 46. The configuration of the die faces 72 corresponds within very close tolerances to the configuration of the base patterns 14a, which in turn corresponds to the original art work 10 shown in FIG. 1.

It is now necessary to remove material from each of the die elements 66 at the middle area of the surfaces 72 to provide raised edge portions, which in the preferred embodiment described herein are knife edges. One method by which this is accomplished is described herein with reference to FIGS. 16 through 24. Since this same sequence of steps is described in my earlier patent, U.S. Pat. No. 3,758,350, mentioned above, these steps will be described only briefly herein.

First, the surfaces 72 of the die elements 66 are ground down a thousandth of an inch or so to provide a good working surface and eliminate any "hook" that might have developed at the edge of each surface 72 as a result of the last etching operation. A grinding instrument is shown schematically in FIG. 16 at 73.

Next, as shown in FIG. 17, a very accurate reproduction of the surfaces 72 of the die elements 66 is made. This is done by placing the die block 46 face up in a container of conventional photographic developing solution 76, and a fully developed photographic glass plate 74 is pressed against the die block 46 so that the die element surfaces 72 come into intimate contact with the photographic glass plate 74 while the developing solution 76 comes into contact with the recessed areas 70 and 68. This contact is maintained for a time sufficient (e.g. one minute) to cause the portions of the photographic glass plate in contact with the developing solution 52 to become developed. Then the photographic glass plate 74 is removed from the developing solution 76 and immediately rinsed in water to remove the developing solution, after which the photographic glass plate 74 is placed in a fixer solution for about 2 minutes. The result is a negative that is an accurate reproduction of the surfaces 72 of the die elements 66.

The next step is to make a "modified reproduction" of the die element pattern impressed on the photographic glass plate 74. This is accomplished by use of the apparatus shown in FIG. 5. However, the method of making this modified reproduction differs from that described with respect to FIGS. 6, 7 and 8 earlier herein, in that a positive of the pattern impressed on the photographic glass plate 74 is first prepared and then mounted to the frame 28. The result is a modified pattern where the edge portions of the image of the die surfaces 72 are reduced in width.

Next, the die recesses 68 and 70 are filled with an etch-resistant epoxy filler 78, such as E-Pox-E glue made by Woodhill Chemical Sales Corporation, of Cleveland, Ohio. The expoxy is applied by hand with a spatula to a level slightly above the die face, as shown in FIG. 18, to permit air bubbles to rise above the die element. After the epoxy has hardened, the epoxy layer is ground down to the level of the surfaces 72 of the die elements 66, as shown in FIG. 19.

Then, an acid resist 80 is applied to the surface of the die, and the modified pattern overlay, indicated at 82, prepared from the photographic reproduction 74 by use of the apparatus of FIG. 5, is placed over the resist coating 80. Light is directed onto the pattern overlay 82 to develop the exposed portions of the resist 80, and the undeveloped portions of the resist 80 are washed away to leave the resist pattern 84 such as that shown in FIG. 21. This resist pattern 84 has portions 86 which overlap the edge portions of the die element surfaces 72, while leaving the middle of the surfaces 72 exposed.

The die block 46 with the modified resist pattern 84 is then baked and etched in substantially the same manner as described above. An etching solution is splashed onto the exposed faces 72 to etch a recess 88 to a depth of about 0.006 inch, as shown in FIG. 21. Again, this can be accomplished in short time increments, with intermediate cleaning by means of a soft brush. The pattern resist 84 is then removed, and the resulting configuration is that shown in FIG. 22. Each die element 66 has a center recess 88 and two upstanding shoulder portions 90. Each shoulder has a slight "hook" on its interior edge, as at 92, due to the undercutting of the etching solution under the overlap areas 86 of the resist pattern 84.

Next, the die block 46, with the epoxy 78 still filling the recesses 68 and 70 (as shown in FIG. 22) is exposed to an etching solution for a short period of time to further deepen the die element cavities 88 and etch laterally into the shoulder portions 90. Since the etching solution tends to work more vigorously on exposed corner portions (such as the area at the "hook" 92 of each shoulder 90) the resulting congifuration are two upstanding knife edges, as shown at 94 in FIG. 23. The epoxy filler 78 is then removed. This can be accomplished quite simply by heating the die 66 to make the epoxy 78 soft, and it is peeled out of the various cavities 68 and 70 with the assist of a scribe.

A die element 96 of the finished die of the present invention is shown in FIG. 24. It can be seen that the die element 96 has a die face area comprising a middle recess 98 and the two upstanding knife edges 100. Extending downwardly from the two knife edges 100 are the two side walls 102 of the die element 96. The upper portion of the surfaces 102 are nearly perpendicular to the plane of the surface of the die, and the two surfaces 102 curve downwardly and outwardly to a moderate degree to result in a moderately decreasing slope in a downward direction.

The slope of these two side walls 102 are substantially symmetrical, which greatly enhances the ability of the die element 96 to be sharpened. With the very small dimensions involved, it is almost impossible to sharpen the knife edges by any sort of mechanical opertion. Rather, this sharpening can best be accomplished by etching, somewhat in the same manner as the etching step described with reference to FIG. 22 above. The cavities adjacent the die elements are filled with an epoxy to the level of the top edge of the knife edges 94, and the die is then exposed to an etching solution for a short period. If the slope of the side walls 102 were not substantially symmetrical, there would be a tendency for the etching solution to work through the knife edges 100 laterally in a manner to produce an uneven cutting edge. However, with the slopes 102 being substantially uniform, the sharpening can be accomplished in a manner that the height of the knife edges remain substantially uniform. Further the background recesses 70 are at a depth greater than the separating recess 68. During the circuit board forming process, this permits the excess foil in the background areas to fold into the recesses 70 without becoming bonded to the substrate of the circuit board being formed.

(d) Second Embodiment for Forming the Individual Die Elements with Raised Edge Portions and a Recessed Middle Portion

While a die having die elements such as those shown in FIG. 24 is quite satisfactory for a large number of circuit board manufacturing operations, in some instances where a rather heavy metal foil is used to form the circuit elements, it is desirable to form the middle recess of each die element to a greater depth, and to accomplish this in such a manner that the two upstanding knife edges of each die element extend above the middle recessed area a greater distance than that achieved by the method described in section (c) above. The manner in which this is accomplished in accordance with this second embodiment is illustrated with reference to FIGS. 25 through 36.

As in the first embodiment, the die block 46 made according to the steps described with reference to FIGS. 1 through 15 has the surfaces 72 of the die elements 66 ground down a thousandth of an inch or so as shown in FIG. 16. Next, as shown in FIG. 17, a very accurate reproduction of the surfaces 72 of the die elements 66 is made, and from this a positive glass plate 104 is made, a portion of this positive 104 being shown in FIG. 25. The portion of the positive 104 shown in FIG. 25 comprises an opaque image 106 which corresponds exactly in configuration to a corresponding surface 72 of a die element 66, with this opaque image 106 being surrounded by a transparent area 108.

The next step is to make three "modified reproductions" from the die element pattern on the photographic glass plate 104. This is done in substantially the same manner as described in Section (c) above by use of the apparatus shown in FIG. 5. However, the method of making these modified reproductions differs from that described with respect to FIGS. 6, 7 and 8 earlier herein, in that a positive of the pattern impressed on the photographic plate 104 is first prepared and then mounted to the frame 28. The result is modified patterns where the edge portions of the image of the die surfaces 106 are reduced in width.

This is done by preparing a first pattern while wobbling the plate 108 about a rather small radius (e.g., 0.006 inch) to arrive at a "slightly reduced" pattern 110a shown in FIG. 26. A second modified reproduction is prepared by rotating the glass plate 108 about a moderately larger radius (e.g., 0.012 inch) to arrive at a "moderately reduced" pattern 110b, shown in FIG. 27. Finally, the photographic plate 108 is rotated about a relatively large radius (e.g., 0.025 inch) to arrive at a "substantially reduced" pattern 110c illustrated in FIG. 28. The above radius dimensions would be suitable for die elements having a minimum width of 0.060 inch or moderately larger.

For purposes of analysis, in each of the patterns 110a, 110b and 110c, the pattern of the original art work which can be considered the "base pattern" is indicated in broken lines at 106a. It can be seen in FIG. 26 that the perimeter of the figure in modified pattern 110a is spaced inwardly from the perimeter of the pattern 106a by a relatively small uniform width dimension of 0.006 inch, with the area between the two perimeters being indicated at 112a. In like manner, the perimeter of the pattern 110b is reduced uniformly by 0.012 inch, with the area between these two perimeters being indicated at 112b. Finally, the pattern 110c is reduced by a uniform width dimension of 0.025 inch, with the area between the two perimeters being indicated at 112b.

The remaining steps of the second embodiment will now be described with reference to a single die element designated 66a. As shown in FIG. 29, the die element 66a is identical or substantially identical to one of the die elements 66 as shown in FIG. 17. As in the prior embodiment, the die recesses 68a on opposite sides of the element 66a are filled with an etch resistant epoxy filler 78a which hardens and is then ground down to the level of the surface 72a of the die element 66a. Next, as shown in FIG. 29, an acid resist pattern 84c is applied to the upper surface of the die in the same manner described in the first embodiment, this pattern 84c corresponding in configuration to the modified pattern illustrated in FIG. 28 at 110c. Thus, this resist pattern 84c has portions 86c which overlap edge portions of the die element surface 72a. These overlapping portions 86c correspond to the perimeter area 112c of FIG. 28, and the exposed area of the die face 72a corresponds to the modified pattern 110c. The die block is then placed in an etching solution to etch a first recess 114 in the die element 66a, as shown in FIG. 30, to a depth of about 0.014 inch. The etching also undercuts the overlapping resist portion 86a by about 0.009 inch, as indicated at 116, and two upstanding edge portions 118 are formed.

Next, as shown in FIG. 31, the resist pattern 84c is removed and a second resist pattern 84b is applied to the die face 72a, this resist pattern 84b corresponding in configuration to that shown at 110b at FIG. 27. The overlap areas 86b correspond to the perimeter area 112b in FIG. 27 and leave the inner upper surface areas of the two upstanding shoulders 118 exposed. Then there is a second etching which increases the depth of the cavity 114 further, to provide a second cavity configuration indicated at 120, which is at a total depth of about 0.022 inch. This second etching also undercuts the overlap resist portion 86b by about 0.004 inch, and the resulting upstanding edge portions are formed in the configuration shown at 118a.

The resist pattern 84b is then removed, and a third resist pattern 84a is applied, this pattern corresponding to that shown at 110a of FIG. 26. It can be seen that the overlapping areas 86a of this pattern 84a extend only slightly beyond the side edges 122 of the die element 66a. There is then a third etching which further increases the depth of the cavity 120 to a configuration indicated at 124 in FIG. 34 to a depth of about 0.030 inch. The etching also undercuts the overlapping resist portion 86a so that the upstanding side portions 118a are further reduced in width to a configuration shown at 118b.

The pattern resist 84a is then removed and with the epoxy 78a still filling the recesses 68a, the die block is again exposed to an etching solution for a short period of time to further deepen the cavity 124 to a configuration shown at 126 in FIG. 35 and also etched laterally into the shoulder portions 118b. Since the etching solution tends to work more vigorously on exposed corner portions, such as the area of the hook 128 on each shoulder portion 118b, the resulting configuration is two upstanding knife edges as shown at 130 in FIG. 35. Alternately, this step could be accomplished by sandblasting with a fine abrasive or in some instances by use of a precision deburring tool.

The epoxy filler 78a is then removed as in the prior embodiment, and a die element 132 of the finished die of the present invention is shown in FIG. 36. It can be seen that the die element 132 has a die face area comprising a middle recess 126 and two upstanding knife edges 130 which extend about 0.030 inch above the level of the recess 126. The end configuration of the die element 132 is quite similar to that shown in FIG. 24, except that with the several etching steps, the depth of the recess 126 is substantially greater, which results in greater height dimensions of the two knife edge portions 130. By using the multi-stage step back etching technique described with reference to FIGS. 25 through 35, the greater depth of the die recess 126 is achieved while obtaining relatively high precision in the configuration of the two knife edges 130, in that these correspond very closely to the pattern of the original art work, and the side walls of each upstanding knife edge 130 are quite uniform with respect to slope.

To review the overall process of the present invention, the first three etching steps described with respect to FIGS. 9 through 15 serve the function of providing flat face die elements 66 which correspond very closely to the pattern of the original art work, and with the configuration of the side walls of the die elements 66 being quite uniform with respect to slope. This results in several advantages. First, with the assurance of being able to reproduce the pattern of the art work onto the die elements within very close tolerances, the spacing of the circuit elements can be made quite close to the minimum desired dimension of separation. Further, the precision within which the top surface and side walls of each die element are made enables the formation of the knife edges on the die element of a height greater than would normally be achieved, while maintaining the evenness of such knife edges within close tolerances. Thirdly, as mentioned above, the sharpening of the edges of the die elements can be better accomplished in a manner to maintain the evenness of the knife edges within close tolerances. With regard to the second embodiment shown in FIGS. 25-36, the same benefits of accurate production are achieved, with the knife edges of the die having substantially greater height than could be achieved by processes normally employed.

With regard to how this is accomplished in the present invention, the rate at which an etching solution etches into a surface depends upon the degree of exposure to the etching solution. Thus, an exposed exterior corner or protrusion etches away at a faster rate than a flat surface with normal exposure to the etching solution. Also a somewhat protected surface area (such as that which exists beneath an overhanging portion of resist material) is etched away at a yet slower rate. It has been found that by using the sequential etching operation described herein, where the protective overlay pattern is applied to the surface of the die in an enlarged pattern and then brought in stages progressively closer to the original art work, the irregularities that might result from uneven etching during one portion of the etching process are substantially eliminated in the subsequent portion of the etching process. The end result is that it is possible to obtain relatively deep recess areas in the die, while maintaining very high precision in the die elements and uniformity in the slope of the side walls of the die elements.

It can be appreciated that the steps of the present invention can be modified for particular requirements. For example, where yet greater depth is needed for the die recesses, additional intermediate etching steps can be included in the process. Further, where somewhat less recess depth and/or precision in the end product is needed, it is possible to leave out the background etching step and go from the separating etch to the turning etch.

EXAMPLE I

A pattern of original art work was prepared substantially as described with respect to FIG. 1, with the individual elements being approximately 15 thousandths inch in width, and the average spacing of adjacent elements being about 50 thousandths inch. The width of the background areas of the art work was greater than 0.060 inch and up to 1/2 inch. Three modified overlay patterns were made, as illustrated in FIGS. 6, 7 and 8. The larger pattern had enlarged edge portions of 30 thousandths inch. The intermediate modified pattern had an expanded edge width of 10 thousandths inch. The third truing modified pattern had an edge enlargement of three thousandths inch.

A rectangular die block made of low carbon steel, 7 inches long, 6 inches wide, and 3/4 inch thick, was cleaned on one of its faces with ferric chloride, scrubbed with pumice and water, water rinsed and air dried. A photo resist material, Kodak KMER Brand, was applied to the die surface. The photo resist layer was air dried for 10 minutes and then baked in an oven at 250° F. for 30 minutes and then air cooled. This was done in a room with yellow safety lighting. A negative prepared from the first larger overlay pattern was placed over the resist and a glass plate was placed on top of the negative to hold it in intimate contact with the resist. An arc lamp, positioned about 24 inches above the glass plate, was turned on to shine onto the negative for about 30 minutes. The die block with the resist material thereon was placed in a resist developing solution to wash away the undeveloped areas of the resist and was then rinsed in water. This provided an acid resist coating corresponding to the first expanded overlay pattern.

The sides and back of the die block were covered with masking tape, and the block was placed in a Master Model PC-32 etching machine, having an etching solution therein which is ferric chloride 35° Baume (diluted with water from 42° Baume) etching solution made by Philip A. Hunt Chemical Corp. The plate was etched for 16 minutes to a depth of approximately 20 thousandths of an inch, and the undercut beneath the resist material was approximately 10 thousandths of an inch. This etching was interrupted every 40 seconds, with the block being removed from the etcher, and the exposed etched surfaces being cleaned with a soft brush. The resulting configuration of the die block was such that those areas corresponding to closely adjacent groups of circuit elements on the original art work, appeared as single relief areas, with those areas corresponding to the background areas of the original art work being recessed to a depth of about 20 thousandths inch.

Next, an acid resisting overlay was applied to the die surface in the same manner as described above, but using the second overlay pattern having a width enlargement of 10 thousandths inch. With this protective overlay applied, the edge portions of the overlay were spaced inwardly from the edge of the relief areas approximately 10 thousandths of an inch.

The die block was again exposed to an etching solution as described above for a period of approximately 10 minutes to etch to an additional depth of about 13 thousandths of an inch. The resulting depth in the previously etched areas was approximately 33 thousandths of an inch, and the recesses formed between adjacent pattern elements was approximately 13 thousandths of an inch. The width of undercut beneath the edges of the pattern was approximately six thousandths of an inch.

A third etching operation was accomplished by means of the third modified overlay pattern. When this pattern was applied to the die block, the edge portions of the resulting overlay pattern were spaced inwardly from the edges of the relief areas only about a thousandth of an inch. The block was then etched for approximately 6 minutes, to bring the side walls of the relief areas to a configuration corresponding very closely to the original art work.

Next, the die block was ground with a surface grinding machine for flatness to remove about one thousandth of an inch of material on the face of the die block. A fully exposed photographic glass plate was immersed in a photographic developing solution, and pressed against the surface of the die, with the die block and the glass plate remaining in contact in the developing solution for one minute. The glass plate and block were removed from the developing solution, and the glass plate was immediately rinsed in cold water and placed in a photographic fix solution. The glass plate was kept in this fix solution for 2 minutes. This resulted in a negative which was an accurate reproduction of the surfaces of the die elements on the die block.

A positive was made from the negative, and the positive was placed over an unexposed photographic glass plate in the apparatus shown in FIG. 5. A circular wobbling motion was imparted to the plate holding the positive glass plate, with the radius of rotation of the eccentric being four thousandths of an inch. An ultra violet lamp placed 10 inches above the film was turned on for 10 seconds, after which the photographic film was developed to make a negative of a modified die pattern. A positive was then made from this negative. The resulting pattern was one corresponding to the original art work, but with the individual figures corresponding to circuit elements being "skinnied" by about four thousandths of a inch along each edge.

Then an acid resist E-Pox-E Glue No. EPX-1 made by Woodhill Chemical Sales Corp. was applied to the die surface by hand with a spatula to a level slightly above the die face to permit bubbles to rise about the die element. The die surface was ground to remove the hardened epoxy down to the lever of the die elements. An acid resist coating such as that indicated above was applied to the die face. The positive of the modified pattern was placed over the photo resist layer, and an ultraviolet lamp above the photo resist layer was turned on to harden the exposed portions of the resist. The die, with the developed photo resist pattern thereon was placed in a resist developing solution to remove the unexposed areas of the resist.

The die blank with the modified resist pattern thereon was placed in an oven and baked for 30 minutes at 250° F. The block was then etched in the manner described above, and this etching was continued for 4 minutes. The die was removed from the etching solution, and the photographic coating was removed by grinding. The die was placed back into the etch solution for about 4 minutes. Then the die was placed on a hot plate and heated to 170° F. to soften the epoxy filler in the recess areas between the die elements, and a scribe was run through the recess areas to remove the epoxy therefrom. The result was a die having the background areas recessed to a depth of about 40 thousandths of an inch, and separating areas recessed to approximately 18 thousandths of an inch. Each die element had at its edge portion raised knife edges, and a recessed middle surface portion about five thousandths of an inch deep. The side walls of each die element adjacent the knife edge extended downwardly, and slanted slightly outwardly from the vertical. A comparison of the resulting die with the original art work indicated that the formation of the die elements was within about plus or minus two thousandths of an inch to the original art work.

EXAMPLE II

The same method was followed as in Example I, except that to form the middle recess areas in the die elements, instead of utilizing a single resist pattern, three modified patterns were used as shown in FIGS. 26, 27 and 28. The first "slightly reduced" pattern corresponding to that shown in FIG. 26 had the perimeters of the die element pattern reduced by 0.006 inch. The "moderately reduced" pattern, corresponding to that shown in FIG. 27, had the perimeters of the die elements pattern reduced by 0.012 inch. The "substantially reduced" pattern, corresponding to that shown in FIG. 28, had the perimeters of the die element pattern reduced by 0.025 inch.

A resist pattern corresponding to the "substantially reduced" pattern was applied to the face of the die, and the die was exposed to an etching solution for approximately 9 minutes to form middle recesses of the die elements of about 0.014 inch deep. Then a second resist pattern, corresponding to the "moderately reduced" pattern was applied to the die face, and the die was exposed to an etching solution for about 5 minutes. This further deepened recesses in the die elements to a depth of about 0.022 inch. Finally, a resist pattern corresponding to the "substantially reduced" pattern was applied to the face of the die and the die was exposed to the etching solution for about 9 minutes. This caused the depth of the recesses in the die elements to reach a depth of about 0.030 inch.

Next, the resist pattern was removed and the die was exposed to an etching solution for about 4 minutes. The resulting die configuration was generally the same as that produced by Example I, except that the height of the knife edges of each die element was approximately 0.030 inch. Also, the width of the individual die elements was at least 0.060 inch. 

What I claim is:
 1. In a precision die comprising a die block having a working face with a plurality of die elements each having a surface area with delineating edge lines and recesses separating said die elements, a method of forming recesses in the surface areas of said die elements, said method comprising: p1 a. providing a plurality of modified reduced overlay patterns, each of which has a pattern area corresponding in configuration to that of the die elements, said reduced overlay patterns each having pattern figures having delineating edge lines spaced inwardly from those of the die elements of the die element configuration by a predetermined substantially uniform width dimension, said overlay patterns comprising at least a first and second reduced overlay pattern, with said first reduced overlay pattern having delineating edge lines spaced inwardly a greater distance, and the second reduced overlay pattern having delineating edge lines spaced inwardly a lesser distance,b. covering the working face of the die block with a first protective overlay corresponding to the first reduced overlay pattern, said first protective overlay having overlapping edge portions that overlap edge portions of the die elements to a greater extent, while leaving middle portions thereof exposed, c. exposing the working face of the die to an etching medium to form recessed areas in the die elements and form upstanding edge portions on said die elements, d. covering the working face of the die block with a second protective overlay corresponding to the second reduced overlay pattern, said second overlay having overlapping edge portions that overlap edge portions of the die elements to a lesser extent, while leaving middle portions thereof exposed, and e. again exposing the working face of the die to an etching medium to deepen and widen said recessed areas to form said upstanding edge portions of the die elements to a narrower configuration conforming with relatively high uniformity to the die element configuration.
 2. The method as recited in claim 1, wherein said second reduced overlay has its overlapping edge portions only partially overlapping the upstanding edge portions formed by the preceding etching operation.
 3. The method as recited in claim 1, wherein recesses between die elements are filled with a protective material, and then subsequent to said second etching with the second reduced protective overlay, with said second reduced overlay removed from the upstanding edge portions of the die elements, the working face of the die is subjected to a further material removing operation to form said upstanding edge portions of the die elements to a relatively sharp configuration.
 4. The method as recited in claim 3, wherein said further material removing operation is accomplished by subjecting the face of the die element to a further etching operation.
 5. The method as recited in claim 3, wherein said further material removing process is accomplished by subjecting the working face of the die to contact with a fine abrasive medium.
 6. The method as recited in claim 1, wherein a third intermediate reduced overlay pattern is provided, which intermediate reduced overlay pattern has delineating edge lines spaced inwardly from the die element configuration by a predetermined substantially uniform width dimension less than that of the first reduced overlay pattern and greater than said second reduced overlay pattern, and said intermediate reduced overlay pattern is applied to the die face as a protective overlay, after which the working face of the die is exposed to an etching medium prior to the step of covering the working face of the die block with the second reduced protective overlay.
 7. The method as recited in claim 1, wherein there are provided three reduced overlay patterns, namely, said first pattern, said second pattern, and an intermediate overlay pattern having delineating edge lines spaced inwardly from the die element configuration by a predetermined substantially uniform width dimension which is greater than that of the second overlay pattern and less than that of the first overlay pattern, and there are three etching steps where an etching medium is applied to the working face of the die element, namely, the etching step after the application of the first overlay pattern, the second etching step performed after the application of the protective overlay corresponding to the second overlay pattern, and an intermediate etching step performed between the first and second etching steps and after the application of the reduced protective overlay corresponding to the intermediate overlay pattern.
 8. A method of making a precision die having a plurality of die elements corresponding within close tolerances to a preselected base pattern of pattern figures with delineating edge lines, said die elements having surface areas with edge portions corresponding closely to the edge lines of related pattern figures, recesses in the surface areas of the die elements, and side walls leading from edge portions of the die elements into recesses on opposite sides of the die element, said method comprising:a. providing a die block having a working face at which the die elements are to be formed, b. providing a plurality of modified enlarged overlay patterns, each of which has a pattern area made up of a base area corresponding in configuration to the base pattern and having an enlarged edge portion extending beyond the delineating edge lines of the base pattern by a predetermined substantially uniform width dimension, said enlarged overlay patterns comprising at least a first and a second enlarged overlay pattern, with the first enlarged overlay pattern having an enlarged edge portion of a greater width, and the second enlarged overlay pattern having an enlarged edge portion of a lesser width corresponding more closely to said base pattern, c. covering the working face of the die block with a first protective overlay corresponding to the first enlarged overlay pattern to protect the working face portion of the die block beneath the pattern area of the first enlarged overlay pattern and leaving the remaining area exposed, d. exposing the working face of the die to an etching medium to form a recessed area at said remaining area and provide a first relief area corresponding generally to said first enlarged overlay pattern, e. covering the working face of the die block with a second protective overlay corresponding to the second enlarged overlay pattern to protect that portion of the relief area beneath the pattern area of the second protective overlay and leave a second remaining area exposed, f. again exposing the working face of the die to an etching medium to remove material from the die block at the exposed second remaining area to cause the relief area to be further formed in a configuration of die elements corresponding more closely to the pattern figures of the base pattern, g. providing a plurality of modified reduced overlay patterns, each of which has a pattern area corresponding in configuration to the die element configuraton after said second etching, said reduced overlay patterns each having pattern figures having delineating edge lines spaced inwardly from the die element configuration by a predetermined substantially uniform width dimension, said reduced overlay patterns comprising at least a first and a second reduced overlay pattern, with the first reduced overlay pattern having delineating edge lines spaced inwardly a greater distance, and the second reduced overlay pattern having delineating edge lines spaced inwardly a lesser distance, h. covering the working face of the die block with a third protective overlay corresponding to the first reduced overlay pattern, said third protective overlay having overlapping edge portions that overlap edge portions of the die elements to a greater extent, while leaving middle portions thereof exposed, i. exposing the working face of the die to an etching medium to form recessed areas in the die elements and form upstanding edge portions on said die elements, j. covering the working face of the die block with a fourth protective overlay corresponding to the second reduced overlay pattern, said fourth overlay having overlapping edge portions that overlap edge portions of the die elements to a lesser extend, while leaving middle portions thereof exposed, and k. again exposing the working face of the die to an etching medium to deepen and widen said recessed areas to form said upstanding edge portions of the die elements to a narrower configuration conforming with relatively high uniformity to the die element configuration.
 9. The method as recited in claim 8, wherein the first etching step is performed to provide the first relief area to a pattern moderately enlarged with respect to the second overlay pattern, and said second protective overlay is applied to the working face of the die to leave exposed edge portions of the first relief area, with said second etching step being accomplished to provide moderately sloping recess defining surfaces on opposite sides of the die elements.
 10. The method as recited in claim 8, wherein an intermediate enlarged overlay pattern is provided, which intermediate enlarged overlay pattern has an enlarged edge portion smaller than the first enlarged overlay pattern and larger than the second enlarged overlay pattern, a protective overlay corresponding to said intermediate enlarged overlay pattern is applied to the first relief area after which the working face of the die block is exposed to an etching medium prior to the step of covering the working face of the die block with said second protective overlay.
 11. The method as recited in claim 10, wherein said intermediate enlarged overlay pattern is applied to the working face of the die block to leave exposed edge portions of the first relief area.
 12. The method as recited in claim 8, wherein said enlarged overlay patterns are provided by first making a negative of said base pattern, placing said negative over a radiation sensitive surface, subjecting said negative to a rotary wobbling motion, while directing radiation through said negative against said radiation sensitive surface, with said first enlarged overlay pattern being formed by imparting the rotary wobbling motion about a greater radius, and the second overlay pattern by imparting the rotary wobbling motion to the negative about a lesser radius.
 13. The method as recited in claim 8, wherein there are provided three enlarged overlay patterns, namely said first enlarged pattern, said second enlarged pattern, and an intermediate enlarged overlay pattern having an enlarged edge portion of a width less than the first enlarged overlay pattern and greater than the second enlarged overlay pattern, and there are three etching steps by use of said enlarged overlay patterns where an etching medium is applied to the working face of the die element, namely, the etching step after the application of the protective overlay corresponding to the first enlarged overlay pattern, the second etching step performed after the application of the protective overlay corresponding to the second enlarged overlay pattern, and an intermediate etching step performed between the first and second etching steps and after the application of a protective overlay corresponding to the intermediate enlarged overlay pattern.
 14. The method as recited in claim 8, wherein said fourth protective overlay corresponding to the second reduced overlay pattern has its overlapping edge portions only partially overlapping the upstanding edge portions formed by the preceding etching operation.
 15. The method as recited in claim 8, wherein recesses between die elements are filled with a protective material, and then subsequent to said etching with the fourth protective overlay corresponding to the second reduced protective overlay, said fourth protective overlay is removed from said die elements, and the working face of the die is subjected to a futher material removing operation to form said upstanding edge portions of the die elements to a relatively sharp configuration.
 16. The method as recited in claim 15, wherein said further material removing operation is accomplished by subjecting the face of the die elements to a further etching operation.
 17. The method as recited in claim 15, wherein said further material removing process is accomplished by subjecting the working face of the die to contact with a fine abrasive medium.
 18. The method as recited in claim 8, wherein a third intermediate reduced overlay pattern is provided, which intermediate reduced overlay pattern has delineating edge lines spaced inwardly from the die element configuration by a predetermined substantially uniform width dimension less than that of the first reduced overlay pattern and greater than that of the second reduced overlay pattern, and said intermediate reduced overlay pattern is applied to the die face as a protective overlay, after which the working face of the die is exposed to an etching medium prior to the step of covering the working face of the die block with the second reduced protective overlay.
 19. The method as recited in claim 8, wherein there are provided three reduced overlay patterns, namely, said first reduced pattern, said second reduced pattern, and an intermediate reduced overlay pattern having delineating edge lines spaced inwardly from the die element configuration by a predetermined substantially uniform width dimension which is greater than that of the second reduced overlay pattern and less than that of the first reduced overlay pattern, and there are three etching steps by use of the reduced overlay patterns where an etching medium is applied to the working face of the die, namely, the etching step after the application of the protective overlay corresponding to the first reduced overlay pattern, the etching step performed after the application of the protective overlay corresponding to the second reduced overlay pattern, and an intermediate etching step performed between the first and second etching steps using the first and second reduced patterns, and after application of a protective overlay corresponding to the intermediate reduced overlay pattern.
 20. The method as recited in claim 8, whereina. there are provided three enlarged overlay patterns, namely said first enlarged pattern, said second enlarged pattern, and an intermediate enlarged overlay pattern having an enlarged edge portion of a width less than the first enlarged overlay pattern and greater than the second enlarged overlay pattern, and there are three etching steps by use of said enlarged overlay patterns where an etching medium is applied to the working face of the die element, namely the etching step after the application of the protective overlay corresponding to the first enlarged overlay pattern, the second etching step performed after the application of the protective overlay corresponding to the second enlarged overlay pattern, and an intermediate etching step performed between the first and second etching steps and after the application of the protective overlay corresponding to the intermediate enlarged overlay pattern, and b. there are provided three reduced overlay patterns, namely, said first reduced pattern, said second reduced pattern, and an intermediate reduced overlay pattern having delineating edge lines spaced inwardly from the die element configuration by a predetermined substantially uniform width dimension which is greater than that of the second reduced overlay pattern and less than that of the first reduced overlay pattern, and there are three etching steps by use of the reduced overlay patterns where an etching medium is applied to the working face of the die, namely, the etching step after the application of the protective overlay corresponding to the first reduced overlay pattern, the etching step performed after the application of the protective overlay corresponding to the second reduced overlay pattern, and an intermediate etching step performed between the the first and second etching steps using the first and second reduced patterns, and after the application of a protective overlay corresponding to the intermediate reduced overlay pattern. 